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Title Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials [electronic resource] / John H. Lau ... [et al.].

Published New York : McGraw-Hill, [2003]


Location Call No. Status
Physical description 1 electronic text : ill.
Series McGraw-Hill handbooks
McGraw-Hill's AccessEngineering
McGraw-Hill's AccessEngineering.
Notes Print version c2003.
Bibliography Includes bibliographical references and index.
Other formats Also issued in print and PDF version.
History notes Contributor biographical information:
Notes Description based on cover image and table of contents, viewed on April 24, 2007.
Other author Lau, John H.
Subject Electronic apparatus and appliances -- Design and construction.
Green products.
Environmental protection.
Electronic apparatus and appliances -- Materials -- Environmental aspects.
Electronic packaging -- Materials -- Environmental aspects.
Microelectronic packaging -- Materials -- Environmental aspects.
Integrated circuits -- Materials -- Environmental aspects.
Polychlorinated biphenals -- Environmental aspects.
Solders and soldering -- Environmental aspects.
Halocarbons -- Environmental aspects.
Lead-free electronics manufacturing processes.
Adhesives -- Environmental aspects.
Electronics -- Materials -- Environmental aspects.
Electronic books.
Internet resources.
Other title Introduction to environmentally benign electronics manufacturing.
Chip- (wafer- ) level interconnects with lead-free solder bumps.
WLCSP with lead-free solder bumps on PCB/substrate.
Chip- (wafer- ) level interconnects with solderless bumps.
WLCSPs with solderless bumps on PCB/substate.
Environmentally benign molding compounds for IC packages.
Environmentally benign die attach films for IC packaging.
Environmental issues for conventional PCBs.
Halogenated and halogen-free materials for flame retardation.
Fabrication of environmentally friendly PCB.
Global status of lead-free soldering.
Development of lead-free solder alloys.
Prevailing lead-free alloys.
Lead-free surface finishes.
Implementation of lead-free soldering.
Challenges for lead-free soldering.
Introduction to conducive adhesives.
Conductivity establishment of conductive adhesives.
Mechanisms underlying the unstable contact resistance of ECAs.
Stabilization of contact resistance of conductive adhesives.
ISBN 0071386246 (print)