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E-RESOURCE

Title Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials [electronic resource] / John H. Lau ... [et al.].

Published New York : McGraw-Hill, [2003]

Copies

Location Call No. Status
 UniM INTERNET Resource    AVAILABLE
Physical description 1 electronic text : ill.
Series McGraw-Hill handbooks
McGraw-Hill's AccessEngineering
McGraw-Hill's AccessEngineering.
Notes Print version c2003.
Bibliography Includes bibliographical references and index.
Contents http://www.loc.gov/catdir/toc/mh031/2002028803.html
Other formats Also issued in print and PDF version.
History notes Contributor biographical information: http://www.loc.gov/catdir/bios/mh041/2002028803.html
Notes Description based on cover image and table of contents, viewed on April 24, 2007.
Other author Lau, John H.
Subject Electronic apparatus and appliances -- Design and construction.
Green products.
Environmental protection.
Electronic apparatus and appliances -- Materials -- Environmental aspects.
Electronic packaging -- Materials -- Environmental aspects.
Microelectronic packaging -- Materials -- Environmental aspects.
Integrated circuits -- Materials -- Environmental aspects.
Polychlorinated biphenals -- Environmental aspects.
Solders and soldering -- Environmental aspects.
Halocarbons -- Environmental aspects.
Lead-free electronics manufacturing processes.
Adhesives -- Environmental aspects.
Electronics -- Materials -- Environmental aspects.
Electronic books.
Internet resources.
Other title Introduction to environmentally benign electronics manufacturing.
Chip- (wafer- ) level interconnects with lead-free solder bumps.
WLCSP with lead-free solder bumps on PCB/substrate.
Chip- (wafer- ) level interconnects with solderless bumps.
WLCSPs with solderless bumps on PCB/substate.
Environmentally benign molding compounds for IC packages.
Environmentally benign die attach films for IC packaging.
Environmental issues for conventional PCBs.
Halogenated and halogen-free materials for flame retardation.
Fabrication of environmentally friendly PCB.
Global status of lead-free soldering.
Development of lead-free solder alloys.
Prevailing lead-free alloys.
Lead-free surface finishes.
Implementation of lead-free soldering.
Challenges for lead-free soldering.
Introduction to conducive adhesives.
Conductivity establishment of conductive adhesives.
Mechanisms underlying the unstable contact resistance of ECAs.
Stabilization of contact resistance of conductive adhesives.
ISBN 0071386246 (print)
007145005X
9780071386241