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Title Bio and nano packaging techniques for electron devices [electronic resource] : advances in electronic device packaging / Gerald Gerlach, Klaus-Jürgen Wolter, editors.

Published Berlin ; New York : Springer, c2012.


Location Call No. Status
Physical description 1 online resource : ill. (some col.)
Contents Part 1. Future of Packaging -- Packaging for Electronic Systems / Gerald Gerlach -- System Integration by Advanced Electronics Packaging / Klaus-Jürgen Wolter -- Nano- and Biotechniques for Electronic Device Packaging / Gerald Gerlach -- Part 2. 3D Modelling and Design for NEMS -- 3D Design / Jens Lienig -- 3D Data Structures for Nanoscale Design / Robert Fischbach -- Uncertainty-Based Design Optimization of MEMS/NEMS / Holger Neubert -- Part 3. Nanoparticles and Confined Nanosystems -- Physical Effects of Nanoparticles and Nanoparticle Ensembles: Impact to System Packaging / Lukas M. Eng -- Photochemical Metallization at the Nanoscale / Thomas Härtling -- Part 4. Nanopatterning for NEMS -- Nanopatterning and Self-Assembly in Microsystems: An Overview / Wolf-Joachim Fischer and Michael Mertig -- Direct Nanoimprinting for Micro- and Nanosystems / Robert Kirchner, Jonathan Derix, Andreas Nocke and René Landgraf -- Platform Technologies for Pico-liter Printing and Nano-imprinting / Steffen Howitz and Thomas Wegener -- Nanosphere Lithography / Martin Waegner -- Nano Lithography Based on Domain Patterning of Ferroelectrics / Alexander Hau{szlig}mann -- Ink-Jet Printing of Conductive Nanostructures / Alexander Türke -- Nanoparticle-Based Resistors and Conductors / Andreas Nocke and Marcus Wolf -- Self-Assembly of Nanowire-Based Field-Effect Transistors / Juliane Posseckardt and Michael Mertig -- Part 5. Nano- and Bio-Funcionalized Surfaces -- Interfacing of Biosystems / Gerhard Rödel and Wolfgang Pompe -- Optical Absorption Layers for Infrared Radiation / Marco Schossig -- Packaging in Synthetic Biology / Jakob Schweizer, Matthias Garten and Petra Schwille -- S-Layer Proteins as Self-Assembly Tool in Nano Bio Technology / Melinda Varga and Nuriye Korkmaz -- Biofunctionalization of Surfaces Using Ultrathin Nanoscopic Collagen Matrices / Jens Friedrichs, Anna Taubenberger, Susanne Wegmann, David A. Cisneros and Clemens Franz, et al. -- Part 6. Biocompatible Materials and Packaging -- Electromagnetic Aspects in Cell Biology / Richard H. W. Funk -- DC Electrodes for Cell Applications / Jonathan Derix and Srikanth Perike -- Biocompatibility of Packaging Materials / Jürgen Uhlemann, Robert Kirchner and Klaus-Jürgen Wolter -- Biostability of Electronic Packaging Materials / Nataliia Beshchasna -- Part 7. System-in-Package for MEMS, Bio-MEMS and MOEMS -- Scaling Effects for Miniaturized Solder Interconnects in Electronic Packages / Maik Müller and Klaus-Jürgen Wolter -- Photonic System Integration of Optical Waveguides in MOEMS / Ralf Rieske -- Biosensing with Optical Waveguides / Tobias Schuster, René Landgraf, Andreas Finn and Michael Mertig -- Direct Encapsulation of OLED on CMOS / Christian Schmidt -- A Hierarchical Modeling Approach of Thermal Vias Using CNT-based Composites / Jörg Hertwig, Holger Neubert and Jens Lienig.
Bibliography Includes bibliographical references and index.
Other author Gerlach, Gerald.
Wolter, Klaus-Jürgen.
Subject Microelectronic packaging.
Optical materials.
Surfaces (Physics).
Materials Science.
Optical and Electronic Materials.
Characterization and Evaluation of Materials.
Electronic books.
ISBN 9783642285226 (electronic bk.)
3642285228 (electronic bk.)