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Cover Art
Author Kaushik, Brajesh Kumar, author.

Title Through silicon vias : materials, models, design, and performance / Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam.

Published Boca Raton : CRC Press, [2017]


Location Call No. Status
Physical description 1 online resource
Contents 1. Three-dimensional technology and packaging techniques -- 2. Through silicon vias : materials, properties, and fabrication -- 3. Copper-based through silicon vias -- 4. Modeling and performance analysis of CNT-based through silicon vias -- 5. Mixed CNT bundled through silicon vias -- 6. Graphene nanoribbon-based through silicon vias -- 7. Liners in through silicon vias -- 8. Modeling of through silicon vias using finite-difference time-domain technique.
Other author Alam, Arsalan, author.
Kumar, Vobulapuram Ramesh, author.
Majumder, Manoj Kumar, author.
Subject Three-dimensional integrated circuits.
Interconnects (Integrated circuit technology)
ISBN 9781315368825 (e-book : PDF)
9781315332758 (e-book: Mobi)
9781498745529 (hardback)
Standard Number 10.1201/9781315368825