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Author Gilleo, Ken.

Title Area array packaging handbook [electronic resource] / Ken Gilleo.

Published New York : McGraw-Hill, [2002]


Location Call No. Status
Physical description 1 electronic text : ill.
Series McGraw-Hill's AccessEngineering
McGraw-Hill's AccessEngineering.
Notes Print version c2002.
Bibliography Includes bibliographical references.
Other formats Also issued in print and PDF version.
History notes Contributor biographical information
Notes Description based on cover image and table of contents, viewed on April 18, 2007.
Other author Lasky, Ronald. C.
Morvan, Y.
Smith, Lee.
Fjelstad, Joseph.
Yasumura, Gary.
Kim, Young Gon.
Randolph, Steve.
Sanders, John.
Cole, Marie S.
Bates, Bill.
Chen, Tim.
Cotterman, Bruce.
Garrett, Dave.
Mohanty, Rita.
Perry, John.
Preveti, Mike.
Lee, Jacob.
Minogue, Gerard.
Hwang, Jennie S.
Rae, Alan.
Blumel, David.
Baldwin, Daniel F.
Johnson, R. Wayne.
Wood, Paul.
Rupprecht, Howard.
Ghaffarian, Raza.
Lazinsky, C.
Belmonte, Joe.
Schiebel, Gunter.
Apell, Marc.
McLenaghan, A. James.
Lewis, Brian.
Jiang, Nan.
Travers, Joseph.
Anderson, Steve.
Zarrow, Phil.
Prismark Partners LLC.
Subject Ball grid array technology.
Microelectronic packaging.
Electronics industries.
Electronic packaging.
Integrated circuits industry.
Flip chip technology.
Electronics -- Materials.
Hermetic sealing.
Solder and soldering.
Multichip modules (Microelectronics) -- Testing.
Screen process printing.
Software measurement.
Electronic apparatus and appliances -- Costs.
Surface mount technology.
Electronic books.
Internet resources.
Other title Introduction to electronic packaging.
Electronics industry overview.
Trends/drivers in the electronics manufacturing industry.
Area array packaging.
Stacked/3d packages.
Compliant ic packaging.
Flip chip technology.
Options in high-density part cleaning.
Mems packaging and assembly challenges.
Ceramic ball and column grid array overview.
Polymer packaging materials: adhesives, encapsulants, and underfills.
Hermetic packaging systems: adhesive and getter.
Area array solder spheres, pastes, and fluxes.
Modern solder and solder paste.
Lead-free systems and process implications.
Electrically conductive adhesives for surfacemount and flip chip processes: an alternative to solder?
Next-generation flip chip materials and processing.
Flip chip assembly and underfilling.
BGA and CSP rework: what is involved?
BGA assembly reliability.
Die attach and rework.
Liquid encapsulation equipment and processes.
Molding for area array packages.
Screen printing and stenciling.
Criteria for placement and processing of advanced packages.
Ovens in electronics.
Process development, control, and optimization.
Metrics : the key to productivity.
Cost estimating for electronic assembly.
The future of electronic packaging.
The future of SMT process equipment.
ISBN 0071449450
0071374930 (print)