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SUBJECTS (1-32 of 32)
Microelectronic packaging.
1
 
    E-RESOURCE 2010

Advanced MEMS packaging / [electronic resource] / John H. Lau ... [et al.].

   
New York : McGraw-Hill,        1 electronic text (xxiii, 552 p.) : ill. 2010
2
 
    E-RESOURCE 2018

Advanced packaging and manufacturing technology based on adhesion engineering : wafer-level transfer packaging and fabrication techniques using interface energy control method / by Seonho Seok.

    Seok, Seonho, author.
Cham : Springer International Publishing,        1 online resource (viii, 115 pages) : 106 illustrations. 2018
3
 
    E-RESOURCE 2002

Area array packaging handbook / [electronic resource] / Ken Gilleo.

    Gilleo, Ken.
New York : McGraw-Hill,        1 electronic text : ill. 2002
6
 
    E-RESOURCE  

Directions for the next generation of MMIC devices and systems / [electronic resource] / edited by Nirod K. Das and Henry L. Bertoni.

   
New York : Plenum Press,        1 online resource (x, 415 pages) : illustrations.  
7
 
    E-RESOURCE 2003

Electronic materials and processes handbook / [electronic resource] / Charles A. Harper, editor in chief.

   
New York : McGraw-Hill,    3rd ed.    1 electronic text : ill. 2003
8
 
    E-RESOURCE 2003

Foldable flex and thinned silicon multichip packaging technology / edited by John W. Balde.

   
Boston : Kluwer Academic Publishers,        1 online resource (xix, 338 pages) : illustrations. 2003
9
 
    E-RESOURCE 2005

Force sensors for microelectronic packaging applications / [electronic resource] / J. Schwizer, M. Mayer, O. Brand.

    Schwizer, J.
Berlin ; London : Springer,        1 online resource (viii, 178 p.) : ill. 2005
10
 
    PRINTED BOOKS c2012

Fundamentals of microfabrication and nanotechnology / Marc J. Madou.

    Madou, Marc J.
Boca Raton, Fla. ; London : CRC,    3rd ed.    3 v. : ill. (some col.) ; 29 cm. c2012
11
 
    PRINTED BOOKS c2002

Fundamentals of microfabrication : the science of miniaturization / Marc J. Madou.

    Madou, Marc J.
Boca Raton : CRC Press,    2nd ed.    723 p. : col. ill. ; 29 cm. c2002
12
 
    E-RESOURCE 2001

Fundamentals of microsystems packaging / [electronic resource] / Rao R. Tummala, editor.

   
New York : McGraw-Hill,        1 electronic text (vii, 967 p.) : col. ill. 2001
13
 
    E-RESOURCE 2008

Introduction to system-on-package (SOP) miniaturization of the entire system / [electronic resource] : Rao R. Tummala, Madhavan Swaminathan.

    Tummala, Rao R., 1942-
New York : McGraw-Hill,        1 electronic text (xx, 785 p.) : ill. 2008
14
 
    E-RESOURCE 2008

Materials for advanced packaging / [electronic resource] / edited by Daniel Lu, C.P. Wong.

   
New York ; London : Springer,        1 online resource. 2008
15
 
    PRINTED BOOKS 2005

MEMS/MOEMS packaging : concepts, designs, metarials, and processes / Ken Gilleo.

    Gilleo, Ken.
New York : McGraw-Hill,        xiii, 220 p. : ill. ; 24 cm. 2005
16
 
    PRINTED BOOKS c2004

MEMS packaging / edited by Tai-Ran Hsu.

   
London : INSPEC,        xxix, 275 p. : ill. ; 26 cm. c2004
17
 
    E-RESOURCE c2004

MEMS packaging / [electronic resource] / edited by Tai-Ran Hsu.

   
London : INSPEC,        xxix, 275 p. : ill. ; 26 cm. c2004
18
 
    E-RESOURCE 2006

Microprocessor design : a practical guide from design planning to manufacturing / [electronic resource] / Grant McFarland.

    McFarland, Grant (Grant W.)
New York : McGraw-Hill,        1 electronic text (xix, 408 p.) : ill. 2006
19
 
    E-RESOURCE 2001

Microvias : for low-cost, high-density interconnects / [electronic resource] / John H. Lau, S.W. Ricky Lee.

    Lau, John H.
New York : McGraw-Hill,        1 electronic text (xxiii, 565 p.) : ill. 2001
20
 
    E-RESOURCE 2014

Microwave and millimeter-wave electronic packaging / Rick Sturdivant.

    Sturdivant, Rick, author.
Boston, [Massachusetts] ; London, [England] : Artech House,        1 online resource (281 pages) : illustrations. 2014
21
 
    PRINTED BOOKS c2005

Millimeter-wave integrated circuits / Eoin Carey, Sverre Lidholm.

    Carey, Eoin.
New York ; Springer,        xv, 268 p. : ill. ; 25 cm. c2005
22
 
    E-RESOURCE 1993

Multichip module technologies and alternatives : the basics / edited by Daryl Ann Doane, Paul D. Franzon.

   
New York : Van Nostrand Reinhold,        1 online resource (xxxii, 875 pages) : illustrations. 1993
23
 
    PRINTED BOOKS c2007

Physical design essentials : an ASIC design implementation perspective / Khosrow Golshan.

    Golshan, Khosrow.
New York : Springer,        xvii, 211 p. : ill. ; 24 cm. c2007
24
 
    E-RESOURCE c2007

Physical design essentials an ASIC design implementation perspective / [electronic resource] : Khosrow Golshan.

    Golshan, Khosrow.
New York : Springer,        1 online resource (xvii, 211 p.) : ill. c2007
25
 
    PRINTED BOOKS 1989

Polymers in microelectronics : fundamentals and applications / David S. Soane and Zoya Martynenko.

    2015 Ch 621.38173 SOAN2015 Ch 621.38173 SOAN Soane, David S., 1951-
Amsterdam ; New York : Elsevier,        xiv, 308 p. : ill. ; 25 cm. 1989
26
 
    E-RESOURCE c2010

Portable consumer electronics packaging, materials, and reliability / [electronic resource] : Sridhar Canumalla, Puligandla Viswanadham.

    Canumalla, Sridhar.
Tulsa, Okla. : PennWell,        xiv, 439 p. : ill. c2010
27
 
    E-RESOURCE 2009

RF and microwave microelectronics packaging / [electronic resource] / edited by Ken Kuang, Franklin Kim, Sean S. Cahill.

   
New York ; London : Springer,        1 online resource (xvi, 285 p.) : ill. 2009
28
 
    E-RESOURCE 2017

RF and microwave microelectronics packaging II / Ken Kuang, Rick Sturdivant, editors.

   
Cham, Switzerland : Springer,        1 online resource (xii, 172 pages) : illustrations (some color) 2017
29
 
    E-RESOURCE 2005

Semiconductor manufacturing handbook / [electronic resource] / Hwaiyu Geng, editor in chief.

   
New York : McGraw-Hill,        1 electronic text : ill. 2005
30
 
    E-RESOURCE  

Thermal stress and strain in microelectronics packaging / [electronic resource] / edited by John H. Lau.

   
New York : Van Nostrand Reinhold,        1 online resource (xxii, 883 pages) : illustrations  
31
 
    E-RESOURCE c2008

Three-dimensional integration and modeling a revolution in RF and wireless packaging / [electronic resource] : Jong-Hoon Lee, Manos M. Tentzeris.

    Lee, Jong-Hoon.
San Rafael, Calif. (1537 Fourth Street, San Rafael, CA 94901 USA) : Morgan & Claypool Publishers,        1 electronic text (x, 108 p. : ill. (some col.)) : digital file. c2008
32
 
    E-RESOURCE 2018

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability / edited by Katsuaki Suganuma.

   
Duxford, United Kingdom : Woodhead Publishing is an imprint of Elsevier,        1 online resource. 2018
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