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SUBJECTS (1-4 of 4)
Microelectronic packaging -- Congresses.
2
 
    E-RESOURCE 2011

Components, packaging and manufacturing technology selected, peer reviewed paper from 2010 International Conference on Components, Packaging and Manufacturing Technology (ICCPMT 2010) Sanya, China, December 9-10, 2010 / [electronic resource] : edited

    International Conference on Components, Packaging and Manufacturing Technology (2010 : Sanya Shi, China)
Switzerland : Trans Tech Publications,        1 online resource : ill. 2011
3
 
    E-RESOURCE 1998

Microelectronic Interconnections and Assembly / [electronic resource] / edited by George Harman, Pavel Mach.

    Harman, George.
Dordrecht : Springer Netherlands,        1 online resource (314 pages). 1998
4
 
    E-RESOURCE  

Proceedings of technical papers / [electronic resource] .

    International Microsystems, Packaging, Assembly Conference.
Piscataway, NJ : Institute of Electrical and Electronics Engineers        v. : ill. (some col.) ; 28-30 cm.  
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