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SUBJECTS (1-3 of 3)
Microelectronic packaging -- Materials.
1
 
    E-RESOURCE 2014

Adhesion in microelectronics / edited by K. L. Mittal and Tanweer Ahsan.

   
Hoboken, New Jersey ; Salem, Massachusetts : Scrivener Publishing : Wiley,        1 online resource (367 pages) : illustrations. 2014
2
 
    E-RESOURCE 2001

Fundamentals of microsystems packaging / [electronic resource] / Rao R. Tummala, editor.

   
New York : McGraw-Hill,        1 electronic text (vii, 967 p.) : col. ill. 2001
3
 
    E-RESOURCE 2012

LCP for microwave packages and modules / [electronic resource] / [edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara.

   
Cambridge ; New York : Cambridge University Press,        xiv, 253 p. : ill. 2012
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