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Cover Art
E-RESOURCE
Author Kuo, Way, 1951-

Title Reliability, yield, and stress burn-in : a unified approach for microelectronics systems manufacturing & software development / by Way Kuo, Wei-Ting Kary Chien, Taeho Kim.

Published Boston, Mass : Kluwer Academic Publishers, [1998]
ñ998

Copies

Location Call No. Status
 UniM INTERNET resource    AVAILABLE
Physical description 1 online resource (xxvi, 394 pages) : illustrations.
Bibliography Includes bibliographical references (pages [333]-361) and index.
Contents 1. Overview of Design, Manufacture, and Reliability -- 2. Integrating Reliability into Microelectronics Manufacturing -- 3. Basic Reliability Concept -- 4. Yield and Modeling Yield -- 5. Reliability Stress Tests -- 6. Burn-in Performance, Cost, and Statistical Analysis -- 7. Nonparametric Reliability Analysis -- 8. Parametric Approaches To Decide Optimal System Burn-in Time -- 9. Nonparametric Approach and Its Applications to Burn-in -- 10. Nonparametric Bayesian Approach for Optimal Burn-in -- 11. The Dirichlet Process for Reliability Analysis -- 12. Software Reliability and Infant Mortality Period of the Bath-tub Curve -- Epilogue: Cost-effective Design for Stress Burn-in -- App. A. Notation and Nomenclature
Summary Reliability, Yield, and Stress Burn-In explains reliability issues in Microelectronics Systems Manufacturing and Software Development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have their infant mortality period for about one year under the ordinary operating conditions, and many of the modern systems, such as the PC's, are heavily used in the first few years, the reliability problem at the infant mortality period becomes extremely important. Burn-in is an accelerated screening procedure that eliminates early on the infant mortalities in the shop before shipping out the products to the customers.
This book will also help readers to analyze systems that exhibit high failure rate during a long infant mortality period. Reliability, Yield, and Stress Burn-In presents ways to systematically analyze burn-in policy at that component, sub-system, and system levels. Various statistical methods are addressed including parametric, nonparametric, and Bayesian approaches. Many case studies are introduced in combination with the developed theories. Included in the book is an introduction to software reliability.
Notes Description based on print version record.
Other author Chien, Wei-Ting Kary, 1965-
Kim, Taeho, 1960-
Subject Integrated circuits -- Design and construction -- Reliability.
Microelectronics -- Reliability.
Computer software -- Development -- Reliability.
Semiconductors -- Computer programs -- Reliability.
Semiconducteurs -- Logiciels -- Fiabilit⥮
Circuits int⥧r⥳ -- D⥶eloppement -- Fiabilit⥮
Micro⥬ectronique -- Fiabilit⥮
Logiciels -- D⥶eloppement -- Fiabilit⥮
Elektronisches Bauelement.
Zuverl衳sigkeit.
Computer software -- Development -- Reliability.
Integrated circuits -- Design and construction -- Reliability.
Microelectronics -- Reliability.
Semiconductors -- Computer programs -- Reliability.
Electronic books.
ISBN 9781461556718 (electronic bk.)
1461556716 (electronic bk.)
0792381076
9780792381075
Standard Number 10.1007/978-1-4615-5671-8