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PRINTED BOOKS

Title Semiconductors : technical information, technologies and characteristic data / [authors, Werner Klingenstein ... and others].

Published Erlangen : Publicis Corporate Pub., [2004]
©2004

Copies

Location Call No. Status
 UniM Store Engin  621.38152 SEMI    AVAILABLE
Edition 2nd rev. and considerably enl. ed. 2004.
Physical description 587 pages : illustrations ; 23 cm
Contents 1.2 Historical overview 14 -- 1.3 Design and functioning of integrated circuits 22 -- 1.4 Other semiconductor components 38 -- 2 Diodes and transistors 45 -- 2.1 High-frequency diodes 45 -- 2.2 Charge carrier life and series resistance of high-frequency PIN diodes 46 -- 2.3 Definition of the capacitances for bipolar transistors 49 -- 2.4 Definition of a small signal RF transistor by the measurement of three parameters 50 -- 2.5 Bipolar RF transistors 54 -- 2.6 Silicon MMICs simplify RF development 59 -- 2.7 Stabilizing current with the BCR 400 operating point stabilizer 65 -- 3 Power semiconductors 68 -- 3.1 Classification 68 -- 3.2 Product development 71 -- 3.3 Product groups 73 -- 3.4 Wafer technologies (front-end) 74 -- 3.5 Packaging technologies (back-end) 85 -- 3.6 Automotive power devices 102 -- 3.7 Power supply and drive applications 132 -- 4 Opto-semiconductors 184 -- 4.1 Physics of optical radiation 184 -- 4.2 Semiconductor lasers 192 -- 4.3 Optocouplers and solid state relays 199 -- 4.4 Optical waveguides 201 -- 4.5 IrDA - data transmission using infrared radiation 213 -- 5 Sensors 216 -- 5.2 Magnetic field sensors 216 -- 5.3 Pressure sensors 231 -- 5.4 Temperature sensors 237 -- 6 Memory 239 -- 6.1 Types of data storage 239 -- 6.2 Fundamentals and areas of use for DRAMs 240 -- 6.3 How DRAMs have become faster 261 -- 7 Microcontrollers 266 -- 7.2 8-bit microcontrollers 266 -- 7.3 16-bit microcontrollers 288 -- 7.4 32-bit TriCore architecture 313 -- 8 Smart cards 329 -- 8.3 Market 329 -- 8.4 Applications 330 -- 8.5 Business relationships network 332 -- 8.6 Products 333 -- 8.7 Cryptographic expertise 334 -- 8.8 Chips for multifunctional cards 336 -- 8.9 "Human interfaces"--a new peripheral 337 -- 8.10 Technology and production 337 -- 8.11 Security 339 -- 8.12 Outlook 340 -- 9 Automotive Silicon Solutions 342 -- 9.1 Electronics in the automobile 342 -- 9.2 Body and convenience electronics 343 -- 9.3 Safety electronics 352 -- 9.4 Powertrain electronics 369 -- 9.5 Infotainment electronics 377 -- 9.6 New 42 V vehicle power supply system 382 -- 9.7 Challenges and opportunities of x-by-wire 392 -- 9.8 Future of automobile electronics 397 -- 10 Entertainment electronics 398 -- 10.1 Broadband communication take-offs 398 -- 10.2 Multimedia card--Ideal mass storage for mobile terminal equipment 404 -- 11 Communication modules 409 -- 11.1 Overview and trends 409 -- 11.2 ISDN: From the exchange to the subscriber 412 -- 11.3 ISDN terminal equipment: The subscriber end 418 -- 11.4 Reference designs for ISDN 423 -- 11.5 Quality analysis in the telephone network 425 -- 11.6 Flexible chip concept reduces costs with PBXs 428 -- 11.7 Next architecture generation of mobile terminal equipment - GOLDenfuture for GSM 432 -- 11.8 Digital answering machines 435 -- 11.9 Handsfree algorithms 440 -- 11.10 DSL architectures 444 -- 12 Customer-specific integrated circuits 453 -- 12.1 Semi-custom IC 453 -- 12.2 Technologies 455 -- 12.3 Package variants 458 -- 12.4 Customer-IC manufacturer cooperation 458 -- 13 Electromagnetic Compatibility - EMC 460 -- 13.2 Electromagnetic compatibility of automotive power ICs 475 -- 13.3 Electromagnetic compatibility of microcontrollers 485 -- 13.4 EMC objectives for wire-line communications 496 -- 13.5 ESD protection measures during handling 506 -- 14 Packages 509 -- 14.1 From physics to innovation - the growing importance of package development 509 -- 14.2 Packages for semiconductor chips - an overview 510 -- 14.3 Driving forces behind package development 512 -- 14.4 Package development around the world 513 -- 14.5 Usability for the customer: fine pitch and alternatives 517 -- 14.6 IC Packaging road map - where is the journey taking us? 518 -- 14.7 Materials aspects 520 -- 15 Quality 522 -- 15.1 Elements that determine quality 522 -- 15.2 Quality measures in business processes 523 -- 15.3 Processability for the customer 525.
Summary "Semiconductors" provides a comprehensive overview of today's standard technologies. The development work involved in such products is also described, along with the variety of them available and their range of possible uses. Future prospects and likely trends are also portrayed. The topics covered extend from the basics of conventional semiconductor technology through standard, power and opto semiconductors to highly complex memories and microcontrollers. Also featured are the special devices and modules for chip cards, automotive electronics, consumer electronics and telecommunication. Some chapters are devoted to the production of semiconductor components and their use in electronic systems, as well as to quality management. For this second edition, all chapters, the product descriptions and characteristic data have been revised and updated. New chapters have been added. The book offers students and users a unique insight into the technology, architecture and applications of semiconductor products. A detailed glossary at the end of the book explains the major technical terms.
Other author Klingenstein, Werner.
Subject Semiconductors.
ISBN 3895780715