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E-RESOURCE

Title Fundamentals of microsystems packaging [electronic resource] / Rao R. Tummala, editor.

Published New York : McGraw-Hill, [2001]

Copies

Location Call No. Status
 UniM INTERNET resource    AVAILABLE
Physical description 1 electronic text (vii, 967 p.) : col. ill.
Series McGraw-Hill's AccessEngineering
McGraw-Hill's AccessEngineering.
Notes Print version c2001.
Bibliography Includes bibliographical references and index.
Contents http://www.loc.gov/catdir/toc/mh023/2001273178.html
Other formats Also issued in print and PDF version.
History notes Contributor biographical information: http://www.loc.gov/catdir/bios/mh041/2001273178.html
Notes Description based on cover image and table of contents, viewed on April 26, 2007.
Other author Tummala, Rao R., 1942-
Morris, James E.
Davidson, Evan.
Sarma, D. H. R.
Hubbard, Bob.
Rao, N. J.
Swaminathan, Madhavan.
Peterson, Andrew F.
Kim, Juongho.
Sitaraman, Suresh K.
Pang, John H. L.
Bar-Cohen, Avram.
Watwe, Abhay.
Seetharamu, Kankanhally N.
Kamath, Sundar M.
Charles, Harry K.
Baldwin, David F.
Garrou, Phil.
Prymak, John.
Bhattacharya, Swapan.
Paik, Kyung.
Cruz Rivera, Jose L.
Gaylord, Thomas K.
Glytsis, Elias N.
Laskar, Joy.
Tentzeris, Emmanouil M.
Schutt-Aine, Jose E.
Ramesham, Rajeshuni.
Ghaffarian, Reza.
Ayazi, Farrokh.
Wong, C. P.
Fang, Treliant.
Varadarajan, Mahesh.
Illyefalvi-Vitez, Zsolt.
ZImmermann, Joachim.
Mattsson, Fredrik.
Kandelid, Stefan.
Raj, Pulugurtha Markondeya.
Liu, Johan.
Ohlckers, Per.
Keezer, David.
Kim, Bruce.
Koppolu, Sasidhar.
May, Gary S.
Shinotani, Ken-ichi.
Malmodin, Jens.
Trankell, Richard.
Qu, Jianmin.
Guo, Yifan.
Subject Electronic packaging.
Microelectronic packaging.
Miniature electronic equipment -- Packaging.
Electronic packaging -- Design.
Electronic apparatus and appliances -- Temperature control.
Chip scale packaging.
Multichip modules (Microelectonics)
Integrated circuits.
Integrated circuits industry.
Passive components.
Integrated passive components.
Optoelectronics.
Radio frequency integrated circuits.
Microelectromechanical systems.
Sealing (Technology)
Miniature electronic equipment (Bonding)
Electronic apparatus and appliances -- Plastic embedment.
Electronics -- Materials -- Surfaces.
Semiconductors -- Surfaces.
Printed circuits -- Design and construction.
Surface mount technology.
Electronic packaging -- Materials.
Microelectronic packaging -- Materials.
Electronics -- Testing.
Microelectronics -- Testing.
Microelectronics -- Design.
Electronic apparatus and appliances -- Reliability.
Electronic books.
Internet resources.
Other title Introduction to microsystems packaging.
Role of packaging in microelectronics.
Role of packaging in microsystems.
Fundamentals of electrical package design.
Fundamentals of design for reliability.
Fundamentals of thermal management.
Fundamentals of single chip packaging.
Fundamentals of multichip packaging.
Fundamentals of IC assembly.
Fundamentals of wafer-level packaging.
Fundamentals of passives : discrete, integrated, and embedded.
Fundamentals of optoelectronics.
Fundamentals of RF packaging.
Fundamentals of microelectromechanical systems.
Fundamentals of sealing and encapsulation.
Fundamentals of system-level PWB technologies.
Fundamentals of board assembly.
Fundamentals of packaging materials and processes.
Fundamentals of electrical testing.
Fundamentals of package manufacturing.
Fundamentals of microsystems design for environment.
Fundamentals of microsystems reliability.
ISBN 0071371699 (print)
0071450033
9780071371698